Bob Ayers
Well-Known Member
Amazing performance, yet no details on the IC technology involved. Liquid/gas cooled?
Ironically, it's probably crunching these huge datasets using FORTRAN compilers and IMSL libraries with roots going back over 40 years... ye olde S/W tools are just so thoroughly debugged, i.e. Verified and Validated (V&V), and so focused on quad-precision floating-point and vector processing.
Sleep well America, secure in the knowledge that NO MicroSquish products are used when it really, REALLY counts.![]()
IBM Zurich just announced this new chip cooling technology:
International Business Machines Corp. said scientists in its Zurich laboratories have demonstrated a way to cool microprocessor chips by pumping water through hair-thin channels in a development that may pave the way for speeding computation by stacking chips atop each other.
Stacked, or three-dimensional, microchips have been regarded as one of the most promising approaches to enhancing chip performance. Stacked chips could shorten the distance that electrons need to travel to just 1/1,000th of the distance they would typically travel in side-by-side chips, moving data faster. But heat buildup between stacked chips would quickly render them useless.
Thomas Brunschwiler, project leader at IBM's Zurich Research Laboratory, said conventional cooling mechanisms can't dissipate the heat. IBM researchers, working in collaboration with scientists at the Fraunhofer Institute in Berlin, developed a method to use cooling water, in a new approach, and to keep it from disrupting the electrical work of the chips.
"By implementing the idea of taking water to the chip, they have taken stacked chips closer to commercialization," said Yogendra Joshi, chair of the school of mechanical engineering at Georgia Institute of Technology, who chaired a conference where the IBM work was reported.
Mr. Brunschwiler that said he anticipates the stacked chips will start showing up in high-performance scientific computers in five to 10 years. Prof. Joshi said he thinks the technology will eventually have broad applications in corporate data centers.
"The challenge was to insulate water from interfering with the electrical signals," Mr. Brunschwiler said. "It's like the human brain, where you mix electrical signals from the neurons with blood vessels that provide cooling and oxygen."
Mr. Brunschwiler said researchers piped water through a horizontal test structure, consisting of a cooling layer between two heat sources. The cooling layer measures only about 100 microns in height and is packed with 10,000 vertical wires known as "vias" that connect the chips above and below. A micron is 1/1,000th of a millimeter. The scientists hermetically sealed the vias by leaving a silicon wall around each and adding a layer of silicon oxide to insulate it to prevent water from causing electrical shorts
Mr. Brunschwiler said his team is working on cooling systems for even smaller chip dimensions and is trying to figure out ways to bring added coolant to exceptionally hot spots in the chip. He said the team had investigated other fluids but concluded water was best because it flowed most easily and didn't cause environmental problems.